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- 2Head 2Stage Laser Puncher
Laser
Industrial processing equipmentトップ2Head 2Stage Laser Puncher
LPU series
- Green sheets, materials for ceramic substrates and green sheet laminates
- LPU-2S208DpJ / LPU-2S208DpK
- LPU-2S108DpJ / LPU-2S108DpK
- High rigid structure and compensation technology to achieve stable and high-accuracy processing
- 5000PPS (galvo speed 2500PPS×2)in double head & double stage processing
- Ultra-compact, automated all-in-one design
- Flexible automation modules optionally available on request
- Small footprint of 4.7 m2 (ST-DT equipped)
- Different laser oscillator types optionally available depending on work material and application
Characteristics
- The original double-head optical scanning system controller and digital galvo scanner allow high-speed and high-accuracy processing.
- Scanning area : □50mm×2heads (LPU-2S208) □30mm×2heads (LPU-2S108)
Max. processing area in conjunction with XY stage : □220 mm×2 - Series lineup
- Microvias down to 50 μm in diameter available on type LPU-2S108
Single head, single stage version for large-size materials (400×400 in size) optionally available - Compact, automated all-in-one design for easy installation
- Small footprint of 4.7 m2 (W 2600×D 1800mm) when ST-DT equipped
- High-stability and high-power CO2 laser
- Low running cost by adopting a sealed-o laser with long gas exchange intervals
- Safety
- Class-1 laser product in compliance with JIS
- Optional automation modules available
- Cleaner unit optionally available
Customized suction table to suit the processing pattern
Standard Specifications
| Model | LPU-2S208DpJ | LPU-2S208DpK | LPU-2S108DpJ | LPU-2S108DpK | |
|---|---|---|---|---|---|
| Work | Material | Ceramic green sheets with or without PET films | |||
| Punching area | Max. 220×220mm, rectangles available | ||||
| Punching area Size, Thickness | Max. 230×230mm, rectangles available; Max. 0.5mm | ||||
| Processing | Hole size | φ70～200μm | φ50～150μm | ||
| Mask change type (dependent on material, thickness, parameters) | |||||
| Method | Mask imaging (Max. 12 masks can be set.) | ||||
| Table | 2 suction tables | ||||
| Capability | Punching accuracy | ±10 μm (on UHT test sheet) | |||
| Galvo processing speed | 2500PPS×2 heads (0.5mm pitch on X-axis) | ||||
| Laser unit | Oscillator | RF excitation CO2 laser Different types of lasers available (e.g. UV lasers, picosecond lasers) |
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| Wave length | 10.6μm | 9.4μm | 10.6μm | 9.4μm | |
| Average output | 450W | 400W | 450W | 400W | |
| Cooling method | External water-cooled chiller | ||||
| Optical unit | Number of processing heads | 2 head | |||
| Method | Optical scanning system with digital galvo scanner | ||||
| Scanning area | Max.□50mm | Max.□30mm | |||
| Laser focus adjustment | Electrically adjusted by software | ||||
| Z axis | Method |
Automatic focus adjustment of optical unit according to sheet thickness |
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| Image processing | Method | Image recognition of alignment marks on sheet surface by camera | |||
| Detection method | Binarized centroid detection or pattern matching | ||||
| Image processing camera | 1 unit×2 heads | ||||
| Camera view | 3.5×2.6mm | ||||
| Lighting | LED ring light (standard: red, optional: white, blue, or green) | ||||
| Control | Control unit | UHT-made dedicated controller | |||
| Operation | Color graphic LCD screen | ||||
| Data editing | Created on manager software installed on PC | ||||
| Data memory capacity | Max. 200,000 positions per file | ||||
| Network |
Processing data transmission from PC to machine via LAN PC can monitor a single machine |
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| Machine cooling | External chiller to cool the machine and optical system | ||||
| External dust collector | Dust collection from above/below sheet and inside the machine | ||||
| Dust control measures | Air purge system for optical units, protection glass for f-theta lens, axis covers | ||||
| Safety measures | Safety covers, key switches, safety interlocks | ||||
| Laser indicator | Green: laser ready (shutter open), red: laser emission in progress | ||||
| Laser class | JIS Class 1 laser product | ||||
| Power source |
2 systems; Machine: 3-phase, 200V AC ±10%, 22kVA |
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| Air source | 0.4～0.7MPa(Clean air) | ||||
| Automation module | Stacking loader "ST-DT" | ||||
| Machine | Dimensions | W2600×D1800×H1600mm | |||
| Weight | Approx. 4400kg | ||||
| Environment | Temperature | 10～35℃(22±2℃ recommended) | |||
| Humidity | 40 - 60% (non-condensing) | ||||
| Vibration | No shock or vibration | ||||
Options
- Mask
nominal dia: 1.4 - 4.0 mm, 0.1 mm increments, sizes to be specified(Square masks available) - Alignment & suction table
- Laser energy measurement function
- Cleaner unit
- *Power box
- *CAD conversion software
- *Control PC & Processing data creation software
*Items with an asterisk are required for the first machine.
Outline Drawing
Example of floor layout
Industrial processing equipment Product lineup
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