Japanese | English | Chinese
RFP-S Series title

TOP > Punching> RFP Series

Laser
Punching
Grinding
Cutting
Peripherals
Overview
History
Locations
Organization Chart
RFP-S Series title
RFP-S20
RFP-S20

Click for data claim
  ROLL TYPE FLEXIBLE SUBSTRATE PUNCHING MACHINE:SWING MIRROR TYPE

RFP-S Series
Characteristics
Thin workpieces can be processed with high speed and high quality.
Thickness:10m•120 punches/min
Our original and new method of swing mirror mechanism is installed. PAT.P.
Easy data processing. Teaching play back method. 
Installing of the testing system. 

Standard Specifications
RFP-S20
Work material/ FPC, A Film of Name Plate
Work size/ Max.500mm (Roll width) Max.350mm
Thickness:10200m(Estimate • depending on a material & a hole diameter)
Working area/ Max.X600×Y500mm
Punched hole diameter/ 0.16.0mm
Punching Accuracy/ 20m (with image processing mode)
Punching Speed/ Max.120punches/min  (Image processing with 20mm pitch in Y direction)
Image processing method/ searching mechanism/Gray scale or detecting and
correcting binary center of gravity
The number of axes/ One axis, Three axes(OP.)


Specifications to subject to be changed without notice.

Contact Us  Privacy Policy  TOP